The die bonding process commonly involves depositing adhesive accurately onto the substrate, extracting the wafer material from the blue film, aligning it with exceptional precision, and then placing it securely onto the adhesive to ensure structural integrity.

Wire bonding is an essential step in LED packaging, where ultra-fine gold wires are precisely utilized to establish dependable electrical links between the bonding pads on the wafer surface and the matching pads on the substrate or lead frame, guaranteeing superior functionality.

Injecting gel to create an external protective coating, where the wafer, gold wire, and other parts are encased in a durable layer of epoxy or silicone. This procedure shields the elements from environmental hazards such as moisture, dust, and mechanical strain.

The baking phase entails exposing the encapsulated LED packages to precisely controlled heat. This pivotal step hardens the encapsulant, guaranteeing that the LED chip remains firmly enclosed and that the intended package shape is perfectly formed.

Light sorting and color binning ensure light output consistency across a batch of LEDs. This process involves measuring the optical characteristics of each LED and grouping them into different bins based on their wavelength, color temperature, and luminous intensity.

Packaged LED beads using tape and reel for efficient handling, sealed them in anti-static bags to prevent damage, and attached labels with key specifications like voltage and wavelength details, preparing the finished products for logistics and global shipment.